Business areas

We produce consumable parts for semiconductor assembly houses, subcontract packaging houses and electronics companies. Across four business areas we manage everything from machining to surface treatment, final inspection and packing.

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  Heat sinks for hybrid RF CATV amplifiers

  Single drop-type heat sinks for SOT115 packages. We produce 2,000,000 pieces a year of the M type.

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  Aluminum blocks for RF

  Aluminum blocks for RF applications, machined on the same lines as our heat sinks.

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  Matrix-type heat spreaders and stiffeners

  Frame-type heat spreaders and stiffeners for high-end FBGA substrates, replacing conventional drop-in heat spreaders placed one by one. We were the first in the world to develop and supply them.

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  Graphite jigs for CBGA packaging

  Jigs and fixtures that carry micro solder balls and hold them in alignment during CBGA packaging.

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Production flow

Etching, anodizing and plating are done with partner companies. Everything else, including outgoing inspection, we do ourselves.

1. Initial machining
2. Precision machiningMachining centers, high-speed machining, downset
3. Surface treatmentBlack oxide, NiP plating and more
4. Final inspection and packingMicroscope inspection, vacuum packing